QphoX – The Gateway to Scalable Quantum Computing

March 8 at 11:05 am
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Quantum computers expand on the existing capabilities of modern computers by solving previously intractable problems. For qubits operating at cryogenic temperatures, the limited cooling power pose severe restrictions on the scalability of quantum computers. Accordingly, transduction between microwave and optical frequencies is a key technology, enabling both long-range quantum interconnects at room temperature and qubit interfaces with a minimal heat load. We present a scalable platform for large bandwidth and ultra-low-noise microwave-to-optics transduction based on a planar superconducting resonator coupled to a photonic cavity through a nanomechanical intermediary. Our system allows us to simultaneously realise strongly coupled electro-mechanical and high-performance opto-mechanical interfaces. The device is extremely compact (< 0.15 mm2), and fully integrated for wafer-scale fabrication.
Mathilde Lemang, Device Integration Lead, QphoX
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Featured Speaker(s):
Mathilde Lemang

Mathilde Lemang

Device Integration Lead QphoX
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QphoX – The Gateway to Scalable Quantum Computing

March 8 @ 11:05 am - 11:15 am

Event Series Event Series (See All)
Featured Speaker(s):
Mathilde Lemang

Mathilde Lemang

Device Integration Lead QphoX

Quantum computers expand on the existing capabilities of modern computers by solving previously intractable problems. For qubits operating at cryogenic temperatures, the limited cooling power pose severe restrictions on the scalability of quantum computers. Accordingly, transduction between microwave and optical frequencies is a key technology, enabling both long-range quantum interconnects at room temperature and qubit interfaces with a minimal heat load.
We present a scalable platform for large bandwidth and ultra-low-noise microwave-to-optics transduction based on a planar superconducting resonator coupled to a photonic cavity through a nanomechanical intermediary. Our system allows us to simultaneously realise strongly coupled electro-mechanical and high-performance opto-mechanical interfaces. The device is extremely compact (< 0.15 mm2), and fully integrated for wafer-scale fabrication.


Mathilde Lemang, Device Integration Lead, QphoX

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Date:
March 8
Time:
11:05 am - 11:15 am
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Keynote Room

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